钨及其碳化物改性金刚石增强金属基复合材料研究进展
张龙* 董鑫 袁涵锋 尹常宇 胡文涛
长沙理工大学材料科学与工程学院,湖南长沙,410076;
摘要:在影响金刚石/金属基复合材料综合性能的众多因素中,界面被认为是影响复合材料力学性能和热物理性 能的关键因素。良好的界面结合不仅可保证两相间载荷的有效传递,更有助于减少因两相间存在的缺陷(如界面 生成物、孔隙、裂纹和脱粘等)而导致的非接触型热阻。W 热导率(178 W/mK)仅次于 Ag、Cu、Al,碳化后生成 的 WC 热导率较高(120 W/mK),并在金属基体中具有极低的溶解度,可最大程度满足低界面热阻的要求,被认 为是金刚石增强金属基复合材料界面改性层最理想的候选材料之一。本文从界面改性的角度综述了钨及其碳化物 在金属基复合材料界面改性的研究进展,并对未来高导热金属基复合材料的发展进行了展望。
关键词:金属基复合材料;钨及其碳化物;界面改性;导热性能
参考文献
[1]Zhang Chun,Wang Richu,Cai Zhiyong,et al. Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing[J].Surface and Coatings Technology,2015,277:299-307.
[2]Kang Qiping,He Xinbo,Ren Shubin,et al.Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles[J].Materials Characterization,2015,105:18-23.
[3]Tan Zhanqiu,Li Zhiqiang,Fan Genlian,et al.Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer[J]. Materials & Design,2013,47:160-166.
[4]Ji Gang,Tan Zhanqiu,Lu Yinggang,et al.Heterogeneous interfacial chemical nature and bonds in a W-coated diamond/Al composite[J].Materials Characterization, 2016, 112:129-133.
[5]Yang Wenshu,Chen Guoqin,Wang Pingping,et al.Enhanced thermal conductivity in Diamond/Aluminum composites with tungsten coatings on diamond particles prepared by magnetron sputtering method[J].Journal of Alloys and Compounds,2017,726:623-631.
[6]Jia Jinhao,Bai Shuxin,Xiong Degan,et al.Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration[J].Ceramics International,2019,45(8):10810-10818.
[7]Zengkai Jiao,Long Zhang, Zejun Deng,et al.Highly conductive diamond skeleton reinforced Cu-matrix composites for high-efficiency thermal management[J].Appllied Surface Science,2024,645:158829.
基金项目:国家自然科学基金(No. 51874370);湖南省自然科学基金(No. 2022JJ40506);湖南省普通高等学校教学改革研究项目(HNJG-2022-0622).